被動元件 友立新科技
被動元件 友立新科技
被動元件 友立新科技 被動元件 友立新科技 english
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被動元件
LED
太陽能
噴砂
 
 

被動元件


MLCC沾銀機-自動沾銀機

  • 高產能:以1005mm之chip為例,每小時可產出640k pcs以上
  • 封閉式沾銀環境,並設有自動補充銀膏的系統
  • 高精準度沾銀範圍控制:3216~0603 mm chip size適用
  • 生產設計可彈性變化,以配合客戶的入料與燒結設備
  • 方便親切的控制介面
規格
 
 
Feeding system capacity

150 pcs (2012 chip size)

Dipping type
Single dipping, Soft Blotting, Blotting
Typical producing time

Production time varies with the kind of dipping process

a. Single dipping: Each carrier plate works for 15 sec.

b. Blotting: Each carrier plate works for 25sec.

c. Soft Blotting: Each carrier plate works for 20 sec.

Vacuum plate accuracy
± 0.01 mm
Paste plate accuracy
± 0.01 mm
Horizontal calibration of doctor blade
± 0.005 mm
Jig replacement time
30 sec.
Paste feeding
An auto detecting & feeding system is standard
Paste Material
Silver or copper
Optional Equipment

a. Auto plate collecting system or in-line drying oven

b. Chip auto loading system
Computer
IBM compatible PC
OS
Window NT
Monitor
LCD panel, touch screen available
Dimension

Length: 127 cm
Width: 90 cm
Height: 159 cm / with light box
130 cm / without light box

Weight: 500 Kg
Utility

Power: AC 3 ψ 4W 380/220V or 3 ψ 3W 220V

Air source pressure: 5Kg / cm 2